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Thermal Management

ARclad® thermally conductive bonding tapes provide an easy-to-use and clean assembly method for bonding heat sinks to microprocessors, resistors,  power supplies, and flexible circuits to heat sinks. 

Advantages of thermally conductive tapes over mechanical fasteners and liquid epoxies include:

  • Reduced Labor Costs
  • Less Use of Expensive PCB Real Estate for Clip Fastening
  • Lower Capital Expenditures for Processing
  • Elimination of Messy Greases & Cure Cycles

 

ARclad® 8043 - Thermal Management
2 mil, Transfer Adhesive

ARclad® 8044 - Thermal Management
5.5 mil, Double-Coated Aluminum Foil Tape
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