ARclad® high-performance PSA foams, films, transfer, and thermally conductive adhesives offer significant advantages over mechanical fasteners, liquid adhesives or epoxies for general electronics assembly.

Easy-to-apply and clean to process, these PSAs require no cure time and do not contain hazardous materials or solvents.  In addition, they offer consistent application thickness, allow for thermal expansion and contraction, and are ideal for bonding irregular or dissimilar surfaces.

General assembly applications in mobile devices may include bonding of:

• Lenses
• Microphones
• Trim