AR offers PSA technologies for reducing mechanical damage to dies during the die sort process in silicon wafer manufacturing.

Our heat-releasable, PSA tapes feature a “stretchable” backing film to allow needle-less removal of fragile die, while reducing mechanical damage. With the application of heat, these tapes release cleanly, leaving no adhesive residue. The stretchable backing allows for easier mounting, dicing and die-removal, while enhancing visual system capabilities.