Device Manufacturers Embrace Electrically Conductive Adhesives


By Deepak Hariharan, Brian Harkins, and Benjamin Wagner
Design News

As device manufacturers face the pressures of faster prototyping, quick changeovers, and the increased use of automation, the advantages of pressure-sensitive adhesives as an alternative material choice for interconnects, grounding, and shielding applications traditionally dominated by labor-intensive soldering operations are becoming more evident. Combining the traditional benefits of the PSA format with additional desirable functional capabilities, such as an electrically conductive adhesive, makes simplification of electronic device design and manufacturing possible.

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