Dual-Stage Adhesive Systems

Dual-stage curable pressure-sensitive adhesive systems from Adhesives Research are formulated to be cured by heat or ultra violet light to form structural bonds. This enables strong, yet flexible bonds, which can be used to replace liquid adhesives or mechanical bonding. The use of dual-stage curable film adhesives can simplify and shorten manufacturing and assembly processes. Additional functional attributes such as controllable open time, moisture and oxygen barrier properties and tailored optical properties may be designed into curable adhesives for applications such as flat panel displays, photovoltaic cells, wafer processing and composite bonding.

Benefits of this technology:

  • Cured by heat or UV light to form structural bonds
  • Forms strong, flexible bonds
  • Facilitates precise control of bond line thicknesses
  • Eliminates the need for fixturing while curing
  • May be formulated with desirable functional attributes including moisture/oxygen barrier and optical properties


  • Flat panel displays
  • Photovoltaic cells
  • Wafer processing
  • Composite bonding